During plasma etching, the temperature of the silicon wafer being processed must remain constant. Energetic ions strike the wafer during etching, transferring heat to the wafer. In the absence of cooling, the wafer temperature will rise. To remove heat from the wafer surface, the electrostatic chuck (ESC) holding the wafer must be cooled Scaling of […]
Greene Tweed has created a new website designed to bring our customers the latest news and product information on Chermraz® perfluorelastomers (FFKM). The website has several new features, including: Interactive tools, such as an Elastomer Selection Guide, to help select the right Chemraz® materials for your application. Basic seal training for customers who are using Chemraz® materials. […]
An electrostatic chuck (ESC) is a device that holds wafers in place during processing in certain semi chambers. During wafer processing and in situ cleaning, plasma may attack the ESC and erode its surfaces, causing particles and electrical issues that affect the wafer and yield. Greene Tweed’s E-Band, composed of Chemraz®, a perfluoroelastomer (FFKM) designed […]
Greene Tweed provides an innovative Chemraz® E38 seal design that lasts longer than a typical o-ring Sometimes the best way to get repeatable seal performance is to protect a seal from exposure to the process and cleaning chemistries it is sealing against. Custom seal designs using Chemraz® and incorporating aluminum or plastic shields have proven […]
Chemraz® 629’s ultra-pure, nano-filler technology was designed to meet the rigorous demands of aggressive plasma systems.
Chemraz® SubFAB (SFX) is a custom-engineered FFKM that withstands harsh chemicals and high temperatures in today’s subfab environment.