Chemraz® 663: Sub-Zero Temperature Seals for Plasma Etch Processes

  • June 4, 2019
  • News Article

During plasma etching, the temperature of the silicon wafer being processed must remain constant. Energetic ions strike the wafer during etching, transferring heat to the wafer. In the absence of cooling, the wafer temperature will rise. To remove heat from the wafer surface, the electrostatic chuck (ESC) holding the wafer must be cooled Scaling of […]



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